Plating Chemistry

Dear Customer,
I would like to announce a great offer for Plating chemistry Formula. All those process acquired from the retired staff of the company.It is an opportunity to shorten your R&D time and cost down.
You can refer to the following list , and let me know which product process interest you.
Thank you in advance and should my services satisfy you, we look forward to working with you.
 

Product Brochure

Pre-treatment

1.         Dry acid salt for pickling and activating metals
A crystalline, acidic, fluoride-containing compound used for etching aluminum, rapid removal of siliceous films from steel, pickling of titanium, stainless steel and magnesium alloys, and etching of glass and sand removal.

2.         Dry acid salt
This non-foaming activator will produce a smut-free, active metal surface on steel, zinc, brass, copper, nickel, aluminum, pewter, Kovar and Invar.

3.         Dry acid salt
A dry powder used in an acid solution to activate passive nickel, ferro-nickel and ferro-nickel deposits prior to chromium plating. It may also be used to activate stainless steel prior to chromium plating.

4.         Dry acid salt
Nickel activate for AL wheel.

5.         Desmutting Aluminum
For AL Wheel

6.         Nitric Acid conditioner
A liquid concentrate, which is added to nitric acid. The solution mixture is used to strip zinc immersion coatings from aluminum.

7.         Quality assured mild acidic etch for plating on Aluminum
A Quality Assured (QA), specially filtered (1 mμ nominal), acidic liquid concentrate for use in the pre-treatment cycle of aluminum alloys prior to electroless nickel plating.

8.         Activating salt containing fluoride
A salt contain fluoride, which reacts acidic in aqueous solutions, and is used for making-up activating solutions copper, copper alloys, zinc die-casts, and steel.

9.         Soak and ultrasonic cleaner for colored metals and Al alloys
A mildly alkaline immersion cleaner with good emulsifying characteristics, for the cleaning of copper and aluminium and their alloys colored metals will hardly discolor and to be attached.

10.      Alkaline degreasing bath for steel and colored metals
An alkaline salt mixture, which contains silicate, for making-up both electrolytic degreasing solution- in combination with suitable emulsifiers-and hot degreasing solutions with good dispersing properties.

11.      Non-Si soak cleaner for Al alloys
Ideal for the non-etch cleaning of aluminum prior to anodizing, chemical milling, chromating, bright dipping, electroless plating and electroplating.

12.      Non-Si soak cleaner for plating EN on AL
A high detergent, quality assured grade, specially filtered one mu nominal), mild alkaline non-etch soak cleaner for aluminum.

13.      Alkaline soak cleaner
A phosphate-free surface conditioner for use in dispersing, emulsifying, and saponifying a wide variety of mineral and organic soils on all common metals except magnesium.

14.      Non scaling alkaline etch cleaner for AL
An alkaline cleaner added to water to produce an etching and cleaning solution for a wide variety of aluminum alloys.

15.      Dilute zincate for plating EN on AL
A cyanide-free dilute Zincate process that is especially designed for plating electro-less nickel on aluminum alloys.

16.      Zincate solution for AL
Consistently produces uniform, fine-grained zinc deposits with a minimum of etching on the aluminum surface.

17.      NON-P ALKALINE CLEANER
Specially for plating zinc, also for steel, brass, copper. High-efficiency, not contain P.

18.      CLEANER FOR STEEL
Non-P, electrolytic degreasing for steel.

19.      CHEMICAL CLEANER FOR STEEL

Chrome Plating

20.      Low foam wetting agent for CR plating
A low-foaming wetting agent added to chromium plating solutions to prevent spray formation during plating by reducing the surface tension of the solution.

21.      Bright chromium plating
A bright decorative chromium plating process based on a mixed-acid chrome electrolyte. It is formulated to provide excellent covering power within a wide range of operating current densities.

22.      Hard chromium plating
A non-fluoride, process for rapid deposition of hard chromium. Its field of application is very wide, ranging from hydraulic components, wear and tear motor articles, down to printing rollers.

23.      Electrolytic Activator for Bright Ni
An electrolytic (cathodic) activator for electroplated bright nickel deposits plated prior to bright chromium plating. It replaces electroless activation in chromic acid.

24.      Trivalent chromium process
A unique trivalent chromium plating process which is used to deposit a bright chromium layer over bright nickel or nickel-iron deposits.

Nickel Plating

25.      BRIGHT NICKEL for racking
A multiple additive, bright nickel process designed to produce superior leveling and brightness using either air agitation or cathode rod agitation. The process is suitable for rack plating of steel, brass, and copper plated components.

26.      BRIGHT NICKEL for racking
A multiple additive, bright nickel process designed to produce highly brilliant, consistently ductile nickel deposits. The process exhibits excellent leveling and throwing power using either air agitation or cathode rod agitation. The process is suitable for rack plating of steel, brass, and copper plated components

27.      BRIGHT NICKEL for racking
A multiple additive, bright nickel process designed to produce superior leveling and brightness using air agitation. It is suitable for rack plating of steel, brass, and copper plated components.

28.      Noble metal initiator prior to electroless nickel plating on copper
An acidic initiator used on non-catalytic copper surfaces prior to processing in electro-less nickel.

29.      CLASSIC BRIGHT NICKEL
A multiple additive, bright nickel process designed to produce superior leveling and brightness using air agitation. It is suitable for rack plating of steel, brass, and copper plated components.

30.      SEMI-BRIGHT NICKEL PLATING
produces extremely ductile sulfur-free, semi-bright nickel deposits having very low stress and extremely clean, bright, low current density areas.

31.      SEMI BRIGHT NICKEL
produces extremely ductile sulfur-free, Semi-bright nickel deposits having very low stress and extremely clean, bright, low current density areas. particularly suitable for complex plastic and zinc-based die casting plating applications.

32.      PEARLBRITE NICKEL
Electrolytic nickel rack plating processes produces uniform, lustrous satin nickel finishes on steel, copper, and copper alloys. Finishes range from micro crystalline satin to a full matte satin.

33.      Service tool for nickel electroplating solutions
Prevents gas pitting in nickel electroplating solutions.

34.      Air agitated nickel sulfate electroplating processes
Used to maintain a semi-bright low stress electroplated nickel deposit. The process is used with soluble anodes and sulfate chemistry in an air agitated plating cell.

35.      NICKEL ADDITIVED D-SPEC
A dispersant which is recommended for use in bright nickel processes to correct persistent fine speckling or pitting problems.

36.      Bright nickel process
Bright nickel process produces full, bright deposits with excellent ductility and leveling at low cost. This process contains no ozone depleting chemicals.

37.      SEMI-BRIGHT NICKEL
Provides an initial semi-bright deposit when duplex nickel plating. Deposits are virtually sulfur-free, well levelled, and very ductile. It is suitable for use with cathodic or air agitation.

Electroless Nickel

38.      High phosphorus, electroless nickel
An advanced electroless nickel process designed to produce deposits exhibiting superior performance in many engineering and functional applications. The carefully selected solution additives provide good solution stability and a moderate plating rate and produce a deposit with minimal or no porosity on properly prepared surfaces.

39.      High speed, stable, bright electroless nickel process
a high speed, stable, bright electroless nickel process with a low to medium phosphorus content (5 to 7% by weight). It combines a fast plating rate and superior brightness needed for production applications with excellent as plated hardness and wear resistance needed for  ngineering applications.

40.      Semi-bright electroless nickel for high-corrosion resistance applications
A moderate speed, semi-bright electroless nickel process. The careful selection of solution additives including the lack of lead and cadmium-containing addition agents, a high phosphorus content and a moderate plating rate, produces a deposit with minimal or no porosity on properly prepared surfaces.

41.      Electro-less nickel/barrier coating for aluminum
An electro-less nickel strike solution for processing aluminum prior to electroless nickel or electrolytic plating. This alkaline electroless nickel process produces a very thin, uniform, active nickel layer.

PALLAD PLATING

42.      Neutral pure palladium process
A neutral pure palladium process with a white, mirror-bright deposition of up to a coating thickness of 0.3 µm.

43.      Neutral pure palladium process
A neutral pure palladium process with a white, mirror-bright deposition of up to a coating thickness of 0.1 µm.

COPPER PLATING

44.      Additive for Acid Cu
It can improve high current density appearance, combat deposit bum and replenish those components in the brightener system that more rapidly depleted by the use of auxiliary anodes.

45.      Bright acid copper process
Bright acid copper process deposits a brilliant ductile copper with excellent leveling. It can be used as an undercoat for a variety of nickel-chromium combinations on steel, brass, aluminum, zinc die castings and plastics.

ALLOY PLATING

46.      Yellow Bronze process （CU-SN-Zn）

47.      White Bronze process II (CU-SN)

48.      White Bronze process III (CU-SN)

49.      SN-CO process, Black
Tin alloy cobalt with an appearance similar to chromium. It can be used in applications of rack and barrel.

50.      SN-NI process, gray
Alloy process of tin-plate-nickel with finished black and slight reddish tonalities. The process can be used in rack and barrel.

51.      PALLAD-NICKEL process

52.      PALLAD-COLBAT process
An alkaline Pd/Ni-process, that has a white, mirror-bright deposition capability of up to 10 µm coating thickness.

ZINC PLATING

53.      Alkaline, non-cyanide zinc plating process for rack and barrel
An alkaline, non-cyanide zinc plating process displays unique properties which result in increased benefits to the user.

ZINC conversion coating

54.      Liquid green chromate conversion coating for zinc
An concentrated liquid chromate, diluted only with water to produce a green chromate film on electroplated zinc.

55.      Black conversion coating for zinc
An immersion process for producing a jet-black chromate conversion coating On zinc electroplate. It can be used on alkaline cyanide and non-cyanide zinc electroplate and chloride zinc deposits in virtually all types of plating equipment

56.      Black, trivalent conversion coating for alkaline zinc-iron and zinc-cobalt alloys
It can Produces a black conversion coating on rack and barrel plated zinc-iron, zinc-cobalt or zinc-cobalt-iron deposits. Used in combination with ENSEAL sealants, the process is a direct replacement for hexavalent black chromates. Meets the ELV Directive to eliminate hexavalent chromates from corrosion resistant finishes.

57.      Transparent,Iridescent Blue trivalent conversion coating
It can produces light colored passivate layers that are clear without clouds or staining. The room temperature process delivers more than 200 hours corrosion protection in neutral salt spray to white rust on rack-plated parts.

58.      TRIVALENT BLUE CONVERSION
Blue Tri., A single component liquid trivalent blue conversion coating for maximum longevity.

59.      TRIVALENT BLUE CONVERSION
Exceptional corrosion resistance. Well suited to meet automotive industry standards.

60.      TRIVALENT BLUE PASSIVATE
A two-component trivalent blue conversion coating for maximum longevity and superior corrosion protection.

61.      TRIVALENT YELLOW-IRIDESCENT PASSIVATE
Thick layer passivate possesses exceptionally high corrosion resistance. Suitable for producing a conversion coating on all zinc and most zinc alloy deposits.

GOLD PLATING

62.      Cobalt hardened gold process
A cobalt hardened, acid gold electroplating process. The process produces bright deposits with excellent resistance to corrosion, oxidation, and wear.

63.      ACID HARDENED GOLD

64.      HIGH SPEED GOLD
Cobalt-hardened gold process provides exceptional distribution. Extremely stable and controllable deposit performances yields reproducible final product.

65.      Neutral Gold

66.      NEUTRAL GOLD SALT
Single component, Use as make-up and replenish and conducting salt

67.      Neutral immersion gold process for copper and copper alloys
A neutral immersion gold process used to deposit 2 to 10 microinches of gold on copper and copper alloys. It is usually used for short term (two months shelf life) solderability protection of copper and copper alloys.

68.      DECORATIVE GOLD-23K (1N14)
Bright acid gold plating processes bring added value to all jewellery creations-verything from charms to flat wear-to give them lasting beauty.

69.      DECORATIVE GOLD PALE YELLOW (2N18)
Bright acid gold plating processes bring added value to all jewellery creations-verything from charms to flat wear-to give them lasting beauty.

70.      HIGH SPEED,ACID GOLD

71.      GOLD STRIKE PLATING PROCESS
An acid type, gold strike electroplating process that provides excellent bondability. It can be used for both rack and barrel plating.

72.      Decorative gold electroplating process
An acid electroplating formulation that produces hard, mirror-bright, rich yellow decorative gold deposits of approximately 23.5 karat. It is adaptable for both rack and barrel plating. It is well-suited for a wide variety of decorative applications including jewelry, watch cases, watch bands, writing instruments, optical frames and other decorative items.

73.      Decorative gold electroplating process, Also apply to PWB

74.      Neutral immersion gold process for copper and copper alloys
A neutral immersion gold process used to deposit 2 to 10 microinches of gold on copper and copper alloys. It is usually used for short term (two months shelf life) solderability protection of copper and copper alloys.

75.      Decorative gold electroplating process
An acid-type electroplating formulation that produces hard, mirror-bright gold deposits of 23 karat to any desired practical thickness. The process contains nickel and cobalt.

76.      Decorative gold electroplating process
An acid-type electroplating formulation that produces hard, mirror-bright gold deposits of 22 karat to any desired practical thickness. The process contains nickel and indium.

PLATING ON PLASTICS

77.      Accelerator for Plating on plastics
Used with sulfuric acid to remove excess tin from plastic surfaces following tin-palladium activation.

78.      Activator for plating on plastics
A concentrated solution of palladium catalyst and stannous chloride dissolved in HCL.

79.      Wetter Use in mixed chromic acid-sulfuric acid etching solutions
It decreases etch surface tension, thereby allowing the etch to uniformly attack the plastic surface and promotes rapid solution drainage from etched parts

80.      Acid copper strike for plating on plastics
A acid copper strike is designed for use in plating on plastics cycles following either electroless copper plate or properly conditioned electroless nickel plate.

81.      Chromic acid free etching of polymers for electroless plating

PWB CHEMICALS

82.      HIGH SPEED ACID COPPER PLATING SOLUTION FOR PWB
An acid copper plating formula with unusually high throwing power, used for producing ductile, bright copper deposits.

83.      Bright acid copper solution
A super throwing power solution which enables increased throwing power in high aspect through hole plating. It has minimal decomposition products which enables stable through hole plating for long periods.

84.      Lead Free Compatible Organic Solderability Preservative
OSP process, high performance copper protective coatings for use on printed wiring boards.

85.      Bonding promoter for the production of multi-layers (Horizontal)
A bonding promoter for inner-layers with extreme high copper loading(up to 50g/L).

86.      Electroless copper plating solution for PWB
A highly stable, room temperature, electroless copper plating solution designed for flash-type PWB process.It deposit a bright pink color and facilitate inspection of through-holes after plating.

87.      Neutralizer/glass etch for multilayer etch back / de-smear process
A high performance neutralizer for use in Etch back/ De-smear Process. It may be used alone as a neutralizer or with either

88.      SUPER MIROETCH (H2SO4-H2O2)

89.      Palladium catalystic process

90.      HASL flux
A heat stable flux used in hot air leveling machines which coat PC boards with solder.

91.      Flux Remover
remove post-soldering residues of water soluble fluxes.

92.      No-Sludge Solder Stripper
A high-performance, single-step, nitric acid based, no-sludge solder stripper especially developed for the spray removal of tin and tin/lead alloys from printed wiring boards.

93.      Defoamer
An alkaline based, non-si defoamer recommended for use in conveyorised spray machines with adversely affecting the equipment.

94.      Micro-Etch
It brightens the Cu surface and ensures the optimum topography for subsequent silver. deposition.

OTHERS

95.      CHROMATE CONVERSION COATING FOR ALUMINUM
A liquid material that is mixed with water to produce a chromate conversion coating for aluminum and aluminum alloys.

96.      Solvent-free, anti-tarnish treatment for silver and silver electroplate

97.      Solvent type, anti-tarnish treatment for silver and silver electroplate

98.      BLACKENING PROCESS FOR ZINC AND ZINC ALLOYS
A method of applying a jet-black inorganic oxide finish to zinc surfaces including electroplated zinc, sheet zinc and zinc base die castings.

99.      GOLD STRIPPER

100.  Cyanide immersion stripper for removal of Au from Steel, nickel and Cu
A powdered materials mixed with water to make up a stripping solution to remove gold from steel, nickel, copper and copper alloys.

101.  GOLD STRIPPER

102.  Electroless Nickel stripper

103.  NICKEL STRIPPER for steel and iron

104.  SILVER STRIPPER,COPPER STRIPPER for nickel

105.  Sulfate-based bright acid tin
Designed to produce extremely bright tin deposits from sulfate based plating solutions.

106.  Stripper for rack

 

Yours Sincerely,

Chris Ng

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